PROCESS CAPABILITY

	ITEM	Mass Producation	Small Batch Producation	Detailed process
	Layers	0-36 Layers	64Layers	If the number of layers exceeds 36, we will conduct a special review
	Material	FR4(Tg 130-180), Halogen free lamination,Rogers, Teflon, Aluminum Board, Arlon,Isola		We have sufficient stock of FR4, some others may need to be purchased
	Surface Finishing	Flash gold(electroplated gold)、ENIG、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、 ENIG+OSP, ENIG +Gold finger,Immersion silver+Gold finger		ENIG is the most common surface Finish and we are also good at other surface finishes
	Surface Treatment			ENIG：Electroless Nickel Immersion Gold  HASL：Hot air solder leveling  OSP： Organic Solderability Preservatives
	Flas Gold  (um)	0.025-0.075	0.025-0.5
	ENIG   (um)	0.05-0.1	0.1-0.2
	HASL  (um)	2-40	2-40
	LF HASL  (um)	2-40	2-40
	OSP(Entek)  (um)	0.2-0.5	0.2-0.5
	Gold Finger  (um)	0.375< X < 1.75	>=1.75
	Hard Gold Plating  (um)	0.375< X < 1.75	>=1.75
	Immsion Sn  (um)	0.8 < X <=1.2
	Max. board size (mm)	580*620	1200*600	The size of the regular version is 580*620mm, and the size exceeding this size is an extra-long board, and the details are subject to document review.
	Min. board size(mm)	10*10	5*10
	Board thickness (mm)	1-2 Layers,    0.2~8mm		The number of layers of the board will affect the thickness of the board, so different layers of the board corresponding to the thickness range is not the same
		4 Layers,       0.4~8mm
		6 Layers,       0.6~8mm
		8 Layers,    1~8mm
		>=10 Layers,   1.2~8mm
	Finished board thickness tolerance	≤ 1.0 mm  ～～～～～ +/-10%		For example, the board thickness T=1.6mm, the actual board thickness is 1.44mm (T－1.6×10%)~1.76mm (T＋1.6×10%)
		1.0～ 1.8mm～～～～～ +/-9%
		1.8～4.0 mm～～～～～ +/-8%
		4.0～7.0 mm～～～～～ +/-7%
		7.0～10.0mm～～～～～ +/-5%
	Min. Line width/space (mil)	4/4mil	3/3mil	Copper thickness has a great influence on min. Line width/space. The data on the left refers to the base copper thickness of 0.33oz
	Min. Line gap	+/-15%	+/-10%
	Outer Layer copper thickness (OZ)	0.5 OZ-7OZ	15 OZ	Copper thickness within 3oz belongs to conventional, and over 3oz belongs to heavy copper
	Inner layer copper thickness	1OZ-7OZ	12 OZ
	Min. Finished hole size(laser hole)-(mil)	3mil, 4 mil,  5 mil, 6mil
	Solder Mask color	Green, Blue, white, Black, Red, Yellow and so on		We can produce various colors of soldermask, if the customer needs we can also provide some special colors
	Carbon Ink Thickness(mil)	0.3mil
	Impedance control tolerance	<=+/-10%	<=8+/-%
	V-cut  (Degree)	20, 30, 45, 60	20, 30, 45, 60	As shown on the right： H：board thickness  β：degree T：remain thickness
	OUTLINE PROFILE
	Min. distance between the IC pads can keep sm bridge(MM)	0.25	0.2	If the spacing is less than the minimum, soldermask dam is likely to fall off
	Min. SM bridge for green soldermask(MM)	0.1	0.076
	Min. SM bridge for black soldermask(MM)	0.125	0.1
	Tolerance of dimension size (MM)	<=+/-0.13	+/-0.1
	Tolerance of board thickness (MM)	>=1.0 +/-10%	+/- 8%
		< 1.0  +/-0.1	+/- 8%
	Tolerance of finished NPTH hole size(MM)	+/-0.05	+/-0.05
	Tolerance of finished PTH hole size(MM)	+/-0.076	+/-0.05
	PCB Type	Backplane、HDI、High multi-layer blind&buried PCB、Backdrill&Heavy copper power PCB