Technical Capacity

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Printed circuit Board (PCB)
Item Mass Producation Small Batch Producation
Small Batch Producation 1-16 Layers 28 Layers
Material FR-4,Halogen free,High TG, PTFE,Aluminum BT,Rogers
Max. board size (mm) 610 *460 635 * 546
Board thickness (mm) 0.3 – 3.5 0.2-6.0
Min. Line width/space (mm) 0.1/0.1 0.076/0.076
Min. Line gap +/-15% +/-10%
Outer Layer copper thickness (OZ) 4 6
Inner layer copper thickness 2 4.5
Min. Finished hole size(Mechanical)-(mm) 0.2 0.15
Min. Finished hole size(laser hole)-(mm) 0.1 0.1
Aspect ratio 10:01 13:01
Solder Mask color Green, Blue, white, Black, Red, Yellow
Impedance control tolerance <=+/-10%
Surface Treatment
Flash Gold (um) 0.025-0.075 0.025-0.5
ENIG (um) 0.05-0.1 0.1-0.2
HASL (um) 1-70
LF HASL (um) 1-70
OSP(Entek) (um) 0.08-0.3
Gold Finger (um) 0.375< X < 1.75 >=1.75
Hard Gold Plating (um) 0.375< X < 1.75 >=1.75
Immsion Sn (um) 0.8 < X <=1.2
V-cut (Degree) 20, 30, 45, 60
Min. distance between the IC pads can keep sm bridge(MM) 0.25 0.2
Min. SM bridge for green soldermask(MM) 0.1 0.076
Min. SM bridge for black soldermask(MM) 0.125 0.1
Tolerance of dimension size (MM) <=+/-0.13 +/-0.1
Tolerance of board thickness (MM) >=1.0 +/-10% +/- 8%
< 1.0 +/-0.1 +/- 8%
Tolerance of finished NPTH hole size(MM) 0.05 0.05
Delivery Time Mass: 10 -14 Days Samples: 4-6 Days

 

PCB Assembly (PCBA)
Max PCB Size (MM) 510 * 460
Min PCB Size (MM) 50 * 50
Board Thickness (MM) 0.4 – 5.0
Components size (MM) 0201 -150
Components max heigh (MM) 25
Max BGA Size (MM) 74 * 74
QFP lead pitch (MM) 0.3 – 2.54
BGA ball pitch (MM) 0.4 – 1.0
BGA ball diameter (MM) 0.45 – 0.76
Min chip size 01 005
Placement precision (MM) +/- 0.03
Laser cut for stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um.