PCBA-HDGPOWER 1-10

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PCBA-HDGPOWER 1-10

Main Features:


 

PCB Assembly (SMT)

Original of place China
Max PCB Size (MM) 510 * 460
Min PCB Size (MM) 50 * 50
Board Thickness (MM) 0.4 – 5.0
Components size (MM) 0201 -150
Components max heigh (MM) 25
Max BGA Size (MM) 74 * 74
QFP lead pitch (MM) 0.3 – 2.54
BGA ball pitch (MM) 0.4 – 1.0
BGA ball diameter (MM) 0.45 – 0.76
Min chip size 01 005
Placement precision (MM) +/- 0.03
Laser cut for stencil manufacture for manual, semi-automatic and full automatic solder print machine, the accuracy can be 5 um.

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