PCB-GZP1501

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PCB-GZP1501

Main Features:

Printed circuit Board (PCB)
Item Mass Producation Small Batch Producation
Small Batch Producation 1-16 Layers 28 Layers
Material FR-4,Halogen free,High TG, PTFE,Aluminum BT,Rogers
Max. board size (mm) 610 *460 635 * 546
Board thickness (mm) 0.3 – 3.5 0.2-6.0
Min. Line width/space (mm) 0.1/0.1 0.076/0.076
Min. Line gap +/-15% +/-10%
Outer Layer copper thickness (OZ) 4 6
Inner layer copper thickness 2 4.5
Min. Finished hole size(Mechanical)-(mm) 0.2 0.15
Min. Finished hole size(laser hole)-(mm) 0.1 0.1
Aspect ratio 10:01 13:01
Solder Mask color Green, Blue, white, Black, Red, Yellow
Impedance control tolerance <=+/-10%
Surface Treatment
Flash Gold (um) 0.025-0.075 0.025-0.5
ENIG (um) 0.05-0.1 0.1-0.2
HASL (um) 1-70
LF HASL (um) 1-70
OSP(Entek) (um) 0.08-0.3
Gold Finger (um) 0.375< X < 1.75 >=1.75
Hard Gold Plating (um) 0.375< X < 1.75 >=1.75
Immsion Sn (um) 0.8 < X <=1.2
V-cut (Degree) 20, 30, 45, 60
Min. distance between the IC pads can keep sm bridge(MM) 0.25 0.2
Min. SM bridge for green soldermask(MM) 0.1 0.076
Min. SM bridge for black soldermask(MM) 0.125 0.1
Tolerance of dimension size (MM) <=+/-0.13 +/-0.1
Tolerance of board thickness (MM) >=1.0 +/-10% +/- 8%
< 1.0 +/-0.1 +/- 8%
Tolerance of finished NPTH hole size(MM) 0.05 0.05
Delivery Time Mass: 10 -14 Days Samples: 4-6 Days

 

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